Packaging waste is one of the fastest-growing environmental challenges worldwide. As consumption rises and e-commerce expands, so does the volume of packaging discarded daily. Effective packaging ...
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How science is redefining modern packaging
The packaging industry plays a pivotal role in product protection, consumer convenience, and, more recently, in environmental ...
NBi FlexPack, the US-based manufacturer of flexible packaging, has adopted electron beam (eBeam) coating technology to add ...
The patent pending packaging is made with a PE-based recyclable film designed to replace laminated, nonrecyclable structures used in snack packaging. ProAmpac's new ProActive Recyclable R-2200 ...
Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.
Amkor Technology's advanced packaging leadership and partnership with TSMC are key growth drivers, targeting a $37 per share price within a year. AMKR's expansion in Korea, Vietnam, and a new facility ...
FALL RIVER, Mass.--(BUSINESS WIRE)-- Packaging Technology Group, Inc (PTG), a leading provider of thermal packaging solutions and services for the biopharmaceutical and life sciences sector, announced ...
CINCINNATI--(BUSINESS WIRE)--ProAmpac, a leader in flexible packaging and material science, announces the launch of ProActive Intelligence Moisture Protect (MP-1000), a patent-pending breakthrough ...
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly specialized field to ...
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...
Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).
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